作者: jdj521 時間: 2013-3-28 11:07 ③.過孔(VIA) : 一般為1.27mm/0.7mm(50mil/28mil); : 當布線密度較高時,過孔尺寸可適當減小,但不宜過小,可考慮采用1.0mm/0.6mm(40mil/24mil)。 作者: jdj521 時間: 2013-3-28 11:07 ④.焊盤、線、過孔的間距要求 : PAD and VIA : ≥ 0.3mm(12mil) : PAD and PAD : ≥ 0.3mm(12mil) : PAD and TRACK : ≥ 0.3mm(12mil) : TRACK and TRACK : ≥ 0.3mm(12mil) : 密度較高時: 作者: jdj521 時間: 2013-3-28 11:08 PAD and VIA : ≥ 0.254mm(10mil) : PAD and PAD : ≥ 0.254mm(10mil) : PAD and TRACK : ≥0.254mm(10mil) : TRACK and TRACK : ≥0.254mm(10mil)